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Vibration locus tracking control method for two-dimensional ultrasonically-assisted grinding

An ultrasonic-assisted, vibrating trajectory technology used in grinding automatic control devices, grinding machine parts, grinding/polishing equipment, etc.

Active Publication Date: 2015-09-09
UNIV OF SHANGHAI FOR SCI & TECH
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  • Abstract
  • Description
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Problems solved by technology

However, there is no way to realize controllable ultrasonic elliptical vibration track tracking control method by using electrical signals and according to the surface changes of optical aspheric processing workpieces.

Method used

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  • Vibration locus tracking control method for two-dimensional ultrasonically-assisted grinding
  • Vibration locus tracking control method for two-dimensional ultrasonically-assisted grinding
  • Vibration locus tracking control method for two-dimensional ultrasonically-assisted grinding

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Embodiment Construction

[0035] In order to obtain the same vibration effect of the ultrasonic elliptical vibration at each processing point in the ultrasonic assisted machining, the present invention realizes a tracking control algorithm that keeps the relative posture and shape unchanged between the ultrasonic elliptical vibration trajectory and the normal direction of the workpiece. Make the ultrasonic elliptical vibration trajectory follow the processing trajectory. When the grinding wheel moves to each processing point on the processing trajectory, according to the needs of optical aspheric processing control, the ultrasonic elliptical vibration trajectory is always kept perpendicular to the normal direction of the current processing point on the workpiece surface. And the shape of the relative vibration track remains unchanged, so that the processing effect with consistent surface distribution can be obtained. The auxiliary control method controls the input electrical signal of the two-phase powe...

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Abstract

The invention relates to a vibration locus tracking control method for two-dimensional ultrasonically-assisted grinding. The method includes the steps that an XOY section machining locus equation is determined according to a machining locus and step length; programming is performed through programming software of a wave function generator, and the ultrasonic elliptical vibration locus is rotated by one angle according to the included angle between tangent lines at machining points of the machining locus equation and the X axis, so that the relative attitude between the elliptical vibration locus and the normal of the machining points is kept unchanged in the machining process; different degrees of amplitude attenuation, generated along with changing of the machining points, of the ultrasonic elliptical vibration locus are compensated for, so that the shape of the ultrasonic elliptical vibration locus is kept unchanged at the machining points; an amplitude transformer outputs ultrasonic vibrations which are controlled by tracking control signals and have corresponding amplitudes, frequencies and phases; finally, the two ultrasonic vibrations are superposed into the ultrasonic elliptical vibration locus at a needed attitude, so that the vibration effects of the machining points are kept uniform, the machining effect of uniform surface distribution of an optical aspherical surface workpiece is achieved, and accordingly surface quality and machining precision of the optical aspherical surface workpiece are improved.

Description

technical field [0001] The invention relates to a processing technology, in particular to a vibration trajectory tracking control method for two-dimensional ultrasonic assisted grinding. Background technique [0002] Grinding is the key process of precision machining, and the grinding quality often determines the final machining accuracy of the workpiece. Among them, ultrasonic vibration assisted processing can obtain very high surface quality and processing accuracy. The traditional ultrasonic cutting vibration mostly adopts one-way vibration mode, but this method has certain deficiencies in the processing of curved surface components, such as optical aspheric components. The vibration effect of the surface is consistent, so the traditional one-dimensional machining cannot be well applied in the curved surface machining. Two-dimensional ultrasonic vibration-assisted machining is a new processing technology that has emerged in recent years. It has been proven that it can a...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B24B1/04B24B51/00
CPCB24B1/04B24B51/00
Inventor 姜晨李文妹苏文静
Owner UNIV OF SHANGHAI FOR SCI & TECH
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