Blanking taking and placing mechanism

Abstract

The invention relates to a blanking taking and placing mechanism which comprises a rotary swing arm mechanism, a pressure maintaining head taking swing arm mechanism, a material taking mechanism, a cavity connecting mechanism and a fixing column. The blanking taking and placing mechanism is characterized in that the rotary swing arm mechanism is arranged in the cavity connecting mechanism, the pressure maintaining head taking swing arm mechanism and the material taking mechanism are arranged on the two symmetric sides of the cavity connecting mechanism respectively, the cavity connecting mechanism is fixed through the fixing column, a rotary portion is arranged on the upper portion of the rotary swing arm mechanism, and a swing arm portion is arranged on the lower portion of the rotary swing arm mechanism. The cavity connecting mechanism is of a half frame structure. The fixing column is arranged on the horizontal side of the cavity connecting mechanism. A workpiece jig is arranged on the material taking mechanism. A robot and a rotary air cylinder mechanism are adopted, station taking and placing are achieved, and pressure maintaining time is shortest, and efficiency is highest. The phenomenon that displacement is prone to happening in the taking and placing process due to the fact that the product size is small and the requirement for assembling position precision is high is avoided.

Description

technical field [0001] The invention relates to the field of mechanical manufacturing, in particular to a material picking and placing mechanism. Background technique [0002] Electronic technology is an emerging technology developed at the end of the nineteenth century and the beginning of the twentieth century. It developed the fastest and was most widely used in the twentieth century, becoming an important symbol of the development of modern science and technology. [0003] The first generation of electronic products centered on the electron tube. At the end of the 1940s, the first semiconductor triode was born in the world. With the characteristics of small size, light weight, power saving, and long life, it was quickly used by various countries and replaced electronic tubes in a large range. In the late 1950s, the first integrated circuit appeared in the world, which integrated many transistors and other electronic components on a silicon chip, making electronic produc...

AI Technical Summary

Problems solved by technology

[0005] The Robot unloading and assembly mechanism is also one of the retrieving and unloading mechanisms developed based on automation equipment. It is used to pick and place the temporary position of the HSG and the pressure holding mechanism. Deviation and misalignment of the position and inaccurate calibration of the product during pick-and-place hindered the development of this new type of automation equipment

Images