Method for improving sparse grain and dense grain of crammed clipped fabric and fabric woven through method
A thin and dense pattern and fabric technology, which is applied to dense weft cut fabrics and improves the thin and dense pattern of dense weft cut fabrics, can solve problems such as thin and dense lines on the surface of fabrics, achieve strong variety adaptability, improve internal quality, improve The effect of splitting strength
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
Method used
Image
Examples
Embodiment
[0032] Bicycle pattern dense weft cut flower fabric
[0033] The fabric is interwoven with warp yarns, ground wefts, first flower wefts and second flower wefts, the warp yarns and ground wefts are interwoven to form the ground part of the fabric, and the warp yarns, the first flower wefts and the second flower wefts are interwoven to form the flower parts of the fabric. The flower part of the fabric is composed of the pattern of riding a bicycle and the points set between the patterns. The two rows of patterns are a cycle, in which the first row of patterns and the second row of patterns are opposite in direction and staggered; the weft yarns of the fabric are arranged in the following order: Repeat the order of 1 ground weft and 1 second flower weft 3 times, then repeat 2 times in the order of 1 ground weft, 1 first flower weft, and 1 second flower weft, and then follow the order of 1 ground weft, The sequence of 1 first flower weft is repeated 33 times, and finally 106 groun...
Embodiment 2
[0040] The arrangement ratio of the ground weft and the extra weft is 1:2, and the rest of the process parameters are the same as in Example 1, and the flower part is reduced by 8%, and the machine weft density on the flower part is 71 threads / inch.
PUM
Abstract
Description
Claims
Application Information
- R&D Engineer
- R&D Manager
- IP Professional
- Industry Leading Data Capabilities
- Powerful AI technology
- Patent DNA Extraction
Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.
© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com