A method for improving copper clad laminate and pcb warping or twisting deformation

A copper clad laminate and warping technology, applied in the field of electronic materials, can solve the problems of high cost, complex process, unfavorable large-scale industrial application, etc., and achieve the effect of low cost, simple operation, and favorable large-scale industrial application.

Active Publication Date: 2015-11-18
GUANGDONG SHENGYI SCI TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0009] The above methods can improve the warpage of printed circuit boards to a certain extent, but their processes are relatively complicated and the cost is high, which is not conducive to large-scale industrial applications

Method used

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  • A method for improving copper clad laminate and pcb warping or twisting deformation
  • A method for improving copper clad laminate and pcb warping or twisting deformation
  • A method for improving copper clad laminate and pcb warping or twisting deformation

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0077] Example 1: Bending strength and deformation resistance of plates with the same thickness and different composition structures. The structure of the copper clad laminate is shown in Table 1 to Table 4.

[0078] Table 1

[0079]

[0080]

[0081] Table 2

[0082]

[0083]

[0084] table 3

[0085]

[0086]

[0087] Table 4

[0088]

[0089]

[0090] For the analysis results of the experimental data in Tables 1 to 4, see Figure 3~Figure 14 shown.

[0091] 1. Tensile strength

[0092] From the results of tensile strength data analysis, for the same thickness of the plate, the tensile strength of S1141 / S1000 / S1000-2 / S1155 does not change purely with the RC and ingredient structure, but is a process of mutual influence, mainly The following two rules:

[0093] (1) In general, as the weight fraction of glass cloth in the sheet decreases, the tensile strength of the sheet also decreases;

[0094] (2) For the 1×7628 and 2×2116 structures with almo...

Embodiment 2

[0099] Embodiment 2: Rigidity comparison of plates containing different numbers of glass cloths

[0100] The structure of the copper clad laminate is shown in Table 5~Table 6.

[0101] In order to further prove that when the RC is almost the same, whether the rigidity of multiple sheets of glass cloth is really better than that of sheets with fewer sheets of glass cloth, the test is carried out, and the results are shown in Table 5~Table 6.

[0102] table 5

[0103]

[0104]

[0105] Table 6

[0106]

[0107]

[0108] For the analysis results of the experimental data in Table 5 to Table 6, see Figure 15~Figure 18 shown.

[0109] The data shows that in the case of almost equal glass cloth weight fractions, the rigidity of the sheet with multiple glass cloth structures is better than that of a single sheet structure.

Embodiment 3

[0110] Embodiment 3: Storage modulus of different batching structural plates

[0111] The structure of the copper clad laminate is shown in Table 7~Table 8.

[0112] Table 7

[0113]

[0114] Table 8

[0115]

[0116] For the analysis results of the experimental data in Table 7 to Table 8, see Figure 19~Figure 20 shown.

[0117] The data analysis results of the storage modulus show that for the plates with the same thickness, the change law of the storage modulus of S1141 / S1000 / S1000-2 / S1155 is consistent with the tensile strength and bending strength, that is, it does not simply vary with the glass cloth structure and RC and change, is the interaction of the two:

[0118] (1) In general, as the weight fraction of glass cloth in the plate decreases, its storage modulus decreases;

[0119] (2) However, for sheets of the same thickness with comparable weight fractions of glass cloth, the storage modulus of sheets with multiple sheets of glass cloth is better than tha...

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Abstract

The invention relates to a method for improving warping of a copper clad laminate and a printed circuit board (PCB) by enhancing the rigidity of the copper clad laminate. The method is mainly implemented by two modes that a multilayer reinforcement material replaces a single-layer reinforcement material, so that a space supporting area of the reinforcement material in the copper clad laminate can be enlarged; and the weight percentage of the reinforcement material in the copper clad laminate is increased, so that the rigidity of the copper clad laminate is improved. By the method, the warping of the copper clad laminate and the PCB can be effectively improved; and the method is easy to operate, low in cost and favorable for large-scale industrial application.

Description

technical field [0001] The invention relates to the technical field of electronic materials, and in particular, the invention relates to a method for improving warping of copper-clad laminates and PCBs. Background technique [0002] Copper Clad Laminate (CCL) is a composite material made by impregnating the reinforcing material with resin, cladding copper foil on one or both sides, and hot pressing. It is used to make printed circuit boards (PCBs). Printed circuit boards have become an indispensable main component for most electronic products to achieve circuit interconnection. [0003] During the production process of CCL and PCB, it is easy to produce processing stress due to high temperature, chemical potion and mechanical processing. If the stress is not released uniformly, it is easy to deform the material and cause warpage. At present, this problem is mainly improved by remedial measures such as baking plates or gravity leveling, and the occurrence of warping problem...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K1/03B32B15/20
Inventor 曾梅燕林振生
Owner GUANGDONG SHENGYI SCI TECH
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