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Component mounting apparatus

A technology for installing machines and components, which is applied to electrical components, electrical components, etc., and can solve problems such as time-consuming, poor processing, and it is extremely difficult for users to change the operation sequence.

Active Publication Date: 2012-08-29
YAMAHA MOTOR CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Therefore, it is extremely difficult for the user to change the operation sequence processing
On the other hand, if the operation sequence is written in an interpreted language, it is relatively easy to change the operation sequence
However, to write the operation sequence of a highly functional component mounting machine in an interpreted language requires thousands to tens of thousands of lines of programming, so the programming and debugging work takes a lot of time
Moreover, in terms of execution speed, it is also worse than processing implemented in compiled languages.

Method used

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Experimental program
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no. 1 Embodiment approach

[0048] Next, a first embodiment of the present invention will be described. The structure of the component mounting machine 1 according to the first embodiment is the same as that described above. figure 1 , 2 have the same structure. In the first embodiment, the component mounting machine 1 includes Figure 4 "Specialized Interpreted Language Processing Execution Subroutines" of image 3 The operation sequence integration unit 52 of the operation sequence. The operation sequence integration unit 52 is written in a compiled language, and integrates a sequence for causing the component mounting machine 1 to repeatedly execute standard sequence operations basically including suction, recognition, and mounting of electronic components. The operation sequence integration unit 52 also determines the execution of the "dedicated interpreted language processing execution subroutine" during the repeated execution of the standard sequence operation. The "dedicated interpreted lang...

no. 2 Embodiment approach

[0070] Next, a second embodiment of the present invention will be described. The structure of the component mounting machine 1 according to the second embodiment is also the same as that described above. figure 1 , 2 have the same structure. This second embodiment includes Figure 4 "Specialized Interpreted Language Processing Execution Subroutines" of Figure 8 integrated processing of the operation sequence. In the present embodiment, the operation sequence integration process is also written in a compiled language to integrate the sequence for causing the component mounter 1 to repeatedly execute the standard sequence operations basically including the adsorption, recognition, and mounting of electronic components, and in the standard sequence In the repeated execution process of , the execution of the "dedicated interpreted language processing execution subroutine" is determined instead of each processing of adsorption, recognition, and mounting of electronic componen...

no. 3 Embodiment approach

[0084] Next, a third embodiment of the present invention will be described. The structure of the component mounting machine 1 according to the third embodiment is also the same as that described above. figure 1 , 2 have the same structure. This third embodiment includes Figure 4 "Specialized Interpreted Language Processing Execution Subroutines" of Figure 12 integrated processing of the operation sequence. In the present embodiment, the operation sequence integration process is also written in a compiled language to integrate the sequence for causing the component mounter to repeatedly execute the standard sequence operations basically including the adsorption, recognition, and mounting of electronic components, and in the standard sequence In the repeated execution process, the execution of the "dedicated interpreted language processing execution subroutine" is determined as needed before or after each processing of adsorption, recognition, and mounting of electronic c...

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PUM

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Abstract

A component mounting apparatus includes: an operational sequence supervision unit which is created in compiler language determining an operational sequence specifying a series of sequence operations of suctioning, recognizing and mounting a component; and a memory unit which stores a custom program, created in interpreter language and specifying an operation different from the series of sequence operations, and custom program designation information that designates execution of the custom program. The operational sequence supervision unit controls a switching process for switching from the series of sequence operations to an interpreter language processing execution routine for executing the custom program, during, or before or after, the series of sequence operations in accordance with the custom program designation information.

Description

technical field [0001] The present invention relates to a component mounting machine which absorbs and recognizes components, mounts the components on a loaded substrate, and then unloads the substrate. Background technique [0002] For a long time, it has been widely known that, for example, the component mounting machine shown in Japanese Laid-Open Patent Publication No. 2009-94283 has: an operation sequence determination unit that specifies a series of sequences (sequence) including adsorption, identification and mounting of components Action; a storage unit that stores component data related to components to be adsorbed and mounted and mounting data specifying coordinates on a substrate on which the component is mounted; and a mounting unit that uses the component data and the mounting data to mount the component to the loaded Then move the substrate out. [0003] Existing component mounters have features for performing such as Figure 23 The operation sequence determin...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K13/04
CPCH05K13/0882Y10T29/49131Y10T29/53174Y10T29/53178H05K13/0409H05K13/08
Inventor 三宅祥史
Owner YAMAHA MOTOR CO LTD
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