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Method for full automatically subpackaging sealing structure glue

A sealed structure, fully automatic technology, used in packaging, bottling machines, liquid bottling, etc., can solve the problems of inaccurate measurement, environmental pollution, affecting the overall quality of products, etc., and achieve the effect of high sub-packaging efficiency and accurate measurement.

Inactive Publication Date: 2009-09-16
叶迪光
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The dispensing of sealing structural adhesive is different from the usual liquid dispensing in that the sealing structural adhesive usually has a relatively high viscosity, so later dispensing is likely to lead to inaccurate measurement and spillage of sealing structural adhesive, which affects the overall quality of the product , and cause environmental pollution
Incomplete packaging process may even cause the loss of the entire batch of sealing structural adhesive

Method used

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  • Method for full automatically subpackaging sealing structure glue

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0015] Before subpackaging the packaging bottles and bottle caps, if there are dirty substances attached, these packaging bottles and bottle caps need to be washed and dried in advance.

[0016] Such as figure 1 As shown, the figure 1 It is a schematic process flow diagram of the present invention. Before subpackaging, it is necessary to obtain qualified structural adhesives through transportation from the pre-installed structural adhesive production device.

[0017] First set the parameters during subpackage operation. The setting can be one or more of the total amount setting, capping time setting, and detection setting;

[0018] Then select the mode to determine the startup mode, operation mode and end mode to be used.

[0019] Then send the bottle, gradually send the structural glue into the packaging bottle, and then start to send the bottle cap. When the structural glue in the bottle is about to reach the set material position, open the three-way to replenish the mate...

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Abstract

The invention discloses a method for full automatically subpackaging sealing structure glue. The method can subpackage the sealing structure glue by repeatedly carrying out the following steps of A. setting parameters during running process; B. sending and loading bottles and gradually sending the structure glue into the packaging bottles; C. supplementing materials for the structure glue in the packaging bottles so that the structure glue achieves the arranged material position; D. opening a scraping motor and scraping the bottle mouth; and E. arranging the bottle cover at the bottle mouth and sealing the bottle. The method can subpackage the sealing structure glue full automatically, has high subpackaging efficiency and exact measurement, and has no splash or leakage of the sealing structure glue during the subpackaging process.

Description

technical field [0001] The invention relates to a method for bottling produced chemical structural adhesives, more specifically, the invention is an automatic packaging method for sealing structural adhesives. Background technique [0002] At present, silicone (containing chemical materials) sealing structural adhesives are required to be produced under vacuum-tight conditions. At present, the production method popularized in China is to use a single cylinder of a planetary mixer to produce in an intermittent manner, so there is a large loss. The dispensing of sealing structural adhesives is different from the usual liquid dispensing. Sealing structural adhesives usually have a relatively high viscosity, so later dispensing is likely to lead to inaccurate measurement and spillage of sealing structural adhesives, which affects the overall quality of the product. , and cause environmental pollution. Incomplete sub-packaging process may even result in the loss of the entire b...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B67C7/00B67C3/26
Inventor 叶照光
Owner 叶迪光
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