A kind of uniform temperature plate filling system and control method

Abstract

The invention discloses a uniform temperature plate filling system and a control method, comprising a working medium storage tank, the top of the working medium storage tank is provided with a filling pipe, and the side wall of the working medium storage tank is provided with a heater; The upper and lower ends of the side wall of the mass storage tank are connected with the booster pump through connecting pipes and tee joints, and the outlet end of the booster pump is connected with the vacuum pump through the tee joints and connecting pipes, and the weighing surface of the dynamic weighing device is equipped with The second heater, the top and bottom ends of the liquid storage tank are connected with connecting pipes; the weighing surface of the dynamic weighing device is provided with a temperature equalizing plate, and the inlet and outlet of the filling cavity in the equalizing plate are respectively connected with charging The injection pipe and the exhaust pipe; the temperature equalizing plates are connected end-to-end through the serial conveying pipe; the outer side of the temperature equalizing plate is respectively provided with an automatic sealing device and an automatic cutting and sealing device at the positions corresponding to the filling pipe and the exhaust pipe. The invention has the advantages of good economical type, good temperature uniformity performance of the uniform temperature plate, long service life and high filling efficiency.

Description

technical field [0001] The invention relates to the technical field of filling of the temperature chamber, in particular to a system and a control method of a temperature chamber. Background technique [0002] With the rapid development of microelectronics technology, the feature size of electronic devices continues to decrease, and the integration degree, packaging density and operating frequency of chips continue to increase, which all lead to a rapid increase in the heat flux density of the chip. Problems such as waste heat and temperature control generated during the operation of electronic equipment need to be solved more effectively, and the high thermal conductivity and good temperature uniformity of the vapor chamber are very effective in solving the problem of high heat flux density. One of the means, the existing vapor chamber filling technology is mainly to use a combination of vacuum pump, molecular pump, etc., to vacuum the product to below 0.01Pa, and then rely...

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Problems solved by technology

Problems such as waste heat and temperature control generated during the operation of electronic equipment need to be solved more effectively, and the characteristics of high thermal conductivity and good temperature uniformity of the vapor chamber have become a very effective solution to the problem of high heat flux electronic heat dissipation. As one of the means, the existing vapor chamber filling technology mainly uses a combination of vacuum pumps and molecular pumps to evacuate the product to below 0.01Pa, and then rely on the vacuum pressure difference to fill the working medium into the vapor chamber product. At the same time, the existing vapor chamber charging needs to be manually operated to control the filling amount of the liquid working medium in the vapor chamber, while heating the phase change working medium from liquid working medium to gaseous working medium and discharged to the atmosphere, and then weighed It is important to observe whether the target charging amount is reached, but the molecular pump in the device is very expensive and economical; it is difficult to fill the chamber of the chamber with liquid working medium only by relying on the pressure difference formed by the degree of vacuum, and the chamber of the chamber will be A lot of non-condensable gas remains, which affects the uniform temperature performance and life of the vapor chamber; the labor cost is high, the charging efficiency is low, and the accuracy of the target charge amount of the liquid working medium in the vapor chamber is low. The space is very large, and it is difficult for vacuum pumps and molecular pumps to pump the entire system to the required vacuum degree, so it is difficult to realize batch filling of vapor chamber products and other issues

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