Chip transfer method, system and equipment

Abstract

The invention provides a chip transfer method, system and equipment, the position of a laminating table is adjusted in real time according to recorded position information of a chip on an element ring, a push needle of a laminating head pierces a blue film on the element ring, and the chip is stripped from the blue film and transferred to a substrate of the laminating table under the chip. The chip transfer device has the beneficial effects that the chip transfer stroke is short, and the efficiency is high; and no intermediate carrying link exists in chip transfer, so that the damage rate of the chip is reduced.

Description

technical field [0001] The invention relates to the technical field of chip / component bonding, in particular to a chip transfer method, system and equipment. Background technique [0002] With the advancement of science and technology, the size of chips is becoming smaller and smaller, especially the development of mini-led and micro-led, which requires higher and higher efficiency of chip transfer. [0003] The current chip transfer method basically relies on an intermediate action to achieve transfer, such as a swing arm or a linear motor pick-up method. These methods are subject to the influence of structure and motion stroke, and the efficiency has been unable to break through. There is a need for a revolutionary chip transfer method to achieve a revolutionary breakthrough in transfer efficiency. Contents of the invention [0004] The invention provides a chip transfer method, comprising the steps of: [0005] Step 1, position recording step: control the component ri...

AI Technical Summary

Problems solved by technology

[0003] The current chip transfer method basically relies on an intermediate action to achieve transfer, such as the swing arm or linear motor pick-up method. These methods are subject to the influence of structure and motion stroke, and the efficiency has been unable to break through.

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