A pcb board insulation lamination laying processing machine and method

Abstract

The invention relates to a PCB insulation laminated layer laying processing machine and a PCB insulation laminated laying processing method. The PCB insulation laminated layer laying processing machine comprises an operation table, a lifting groove is formed in the middle of the operation table, and an adjusting mechanism is arranged in the lifting groove; a pushing mechanism is arranged at the left side of the operation table, and a laminating mechanism is arranged at the right side of the operation table. According to the invention, the following problems existing during the laying process of the existing PCB insulation lamination that a, the placement between a corresponding core plate and a prepreg needs to be controlled manually, the manual control operation labor intensity is high, and the core boards are easy to place disorderly during the placement process, so that the normal use of a PCB is influenced; b by manually controlling the placement of the materials, the uniformity ofthe corresponding core boards after lamination cannot be ensured, the laminated materials need to be corrected, the laying time of the insulating layers of the PCBs is prolonged, and the laying efficiency is reduced, can be solved.

Description

technical field [0001] The invention relates to the technical field of PCB board processing, in particular to a PCB board insulation lamination laying processing machine and method. Background technique [0002] The Chinese name of the PCB board is a printed circuit board, also known as a printed circuit board, which is an important electronic component, a support for electronic components, and a carrier for the electrical connection of electronic components. When the PCB board is made, the insulation laminate of the PCB board is composed of materials such as the base core board, the prepreg, and the insulation core board. The insulation laminate is mainly made by laying. [0003] However, the following problems exist in the laying process of the existing PCB insulation laminates: a. It is necessary to manually control the placement between the corresponding core board and the prepreg. The position is disordered, which affects the normal use of the PCB board. b. Manually co...

AI Technical Summary

Problems solved by technology

[0003] However, the following problems exist in the laying process of the existing PCB insulation laminates: a. It is necessary to manually control the placement between the corresponding core board and the prepreg. The position is disordered, which affects the normal use of the PCB board. b. Manually controlling the placement of materials cannot ensure the orderliness of the laminated core boards. It is necessary to correct the laminated materials, which prolongs the laying time of the PCB insulation layer. Reduced laying efficiency

[0004] For the current technical problems in the production process of PCB boards, personnel in the relevant technical fields have conducted research and made adaptation improvements, such as the Chinese invention patent of a PCB board processing method with the patent number 200910109835X, which saves labor costs. The efficiency of burr repair is improved, but the difficulties in the laying process of the PCB insulation laminate mentioned above are not mentioned

Images