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Double-layer overlapping PCB hole opening process equipment and process method thereof

A kind of process equipment and overlapping technology, applied in the direction of metal processing, etc., can solve the problems of easy deformation, chips and chips that cannot be discharged in time, and low precision

Active Publication Date: 2019-12-17
江西豪越鑫电子有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] Drilling after overlapping two pcb blanks will significantly improve the drilling efficiency, and because they are completely overlapped, the consistency of the hole positions after drilling of the two boards is very high, but the two PCB blanks do not differ. The overlapping of the gaps will increase the thickness, and the chips and debris cannot be discharged in time when the drill bit is opened, resulting in a large number of burrs in the holes and low precision; if there is a gap between the two PCB blanks, the PCB board will be damaged by the drill bit. It is easy to deform due to downward pressure, resulting in low drilling accuracy

Method used

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  • Double-layer overlapping PCB hole opening process equipment and process method thereof
  • Double-layer overlapping PCB hole opening process equipment and process method thereof
  • Double-layer overlapping PCB hole opening process equipment and process method thereof

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Embodiment Construction

[0046] The present invention will be further described below in conjunction with the accompanying drawings.

[0047] as attached Figures 1 to 13 The shown double-layer overlapping PCB drilling process equipment includes an equipment platform 1, and a first pcb board to be perforated 19.1 and a second perforated pcb board 19.2 with a square outline are overlapped on top of the equipment platform 1 ;

[0048] It also includes two sets of pcb board positioning mechanisms, each set of pcb board positioning mechanisms includes four corner wrapping parts 9 in a vertical triangular structure, and corner wrapping openings 60 are provided on the sides of each of the corner wrapping parts 9; The four corners of the first pcb board 19.1 to be perforated and the second pcb board 19.2 to be perforated are inserted into the corner wrapping openings 60 of the four corner wrappers 9 correspondingly;

[0049] A hole opening mechanism is also provided above the first pcb board to be holed 19...

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PUM

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Abstract

The invention discloses double-layer overlapping PCB hole opening process equipment. The equipment comprises an equipment platform, wherein a first to-be-opened pcb and a second to-be-opened pcb withsquare outlines are arranged above the equipment platform in an overlapped mode; the equipment further comprises two sets of pcb positioning mechanisms, each set of pcb positioning mechanisms comprises four corner wrapping pieces of vertical triangular structures, and the side parts of each corner wrapping piece are provided with corner wrapping openings; and four top corners of the first to-be-opened pcb and four top corners of the second to-be-opened pcb are movably inserted into the corner wrapping openings of the four corner wrapping pieces correspondingly. According to the double-layer overlapping PCB hole opening process equipment, the upper side face of a movable supporting beam on a first rotating supporting plate is always just right below a rotating drill bit, and therefore the movable supporting beam plays a role in lifting and supporting drilling parts of the first to-be-opened pcb.

Description

technical field [0001] The invention belongs to the field of PCB technology. Background technique [0002] Drilling after overlapping two pcb blanks will significantly improve the drilling efficiency, and because they are completely overlapped, the consistency of the hole positions after drilling of the two boards is very high, but the two PCB blanks do not differ. The overlapping of the gaps will increase the thickness, and the chips and debris cannot be discharged in time when the drill bit is opened, resulting in a large number of burrs in the holes and low precision; if there is a gap between the two PCB blanks, the PCB board will be damaged by the drill bit. It is easy to deform due to downward pressure, resulting in low drilling accuracy. Contents of the invention [0003] Purpose of the invention: In order to overcome the deficiencies in the prior art, the present invention provides a double-layer overlapping PCB drilling process equipment and a process method that...

Claims

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Application Information

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IPC IPC(8): B26F1/16B26D7/01B26D7/26B26D5/04B26D7/18
CPCB26D5/04B26D7/01B26D7/18B26D7/2628B26F1/16
Inventor 宋志龙
Owner 江西豪越鑫电子有限公司
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