Swing device for hanging tool

A swing device and hanger technology, applied in the direction of cells, electrolysis process, electrolysis components, etc., can solve the problems of foaming on the surface of the plated parts, bubbles on the surface of the plated parts, uneven solution, etc., to increase the swing range and improve the quality of electroplating , Improve the effect of uniformity

Pending Publication Date: 2019-12-13
SHANDONG TAIKAI HIGH VOLTAGE SWITCH
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, as the electroplating proceeds, the concentration of the solution near the plated parts will decrease, which will cause a large difference in the concentration of the solution in different areas in the electroplating tank, and bubbles may appear on the surface of the plated parts, all of which will affect the electroplating effect
[0003] In the prior art, the stirring of the solution is usually achieved by the reciprocating motion of the electroplating flybar, so as to avoid problems such as foaming on the surface of the plated parts and uneven solution.
However, due to the gravity of the plated parts and hangers and the resistance of the solution, it is easy to appear that the moving distance of the plated parts near the end of the electroplating bar is greater than that of the plated parts far away from the electroplating bar, resulting in uneven plating quality

Method used

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  • Swing device for hanging tool
  • Swing device for hanging tool
  • Swing device for hanging tool

Examples

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Embodiment Construction

[0027] Hereinafter, exemplary embodiments of the present disclosure will be described in detail with reference to the accompanying drawings so that those skilled in the art can easily realize them. Also, for clarity, parts not related to describing the exemplary embodiments are omitted in the drawings.

[0028] In the present disclosure, it should be understood that terms such as "comprising" or "having" are intended to indicate the presence of features, numbers, steps, acts, components, parts or combinations thereof disclosed in the specification, and are not intended to exclude one or a plurality of other features, numbers, steps, acts, parts, parts or combinations thereof exist or are added.

[0029] In addition, it should be noted that, in the case of no conflict, the embodiments in the present disclosure and the features in the embodiments can be combined with each other. The present disclosure will be described in detail below with reference to the accompanying drawings...

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PUM

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Abstract

The embodiment of the invention discloses a swing device for a hanging tool. The swing device for the hanging tool comprises a connection structure and at least one wing-shaped structure, wherein theconnection structure is used for connecting one or more hanging tools, and the wing-shaped structure is connected to the connection structure. In any cross section of the wing-shaped structure, the length of an upper curve is greater than the length of a lower curve, wherein the cross section is vertical to the extension direction of the connection structure; the upper curve of the cross section is the projection of the upper surface of the wing-shaped structure in the cross section; and the lower curve of the cross section is the projection of the lower surface of the wing-shaped structure inthe cross section. According to the technical scheme, stirring for a solution can be enhanced through the wing-shaped structure, so that the uniformity of the solution is improved, the consistency ofthe swing amplitudes of plated parts is improved, and then the uniformity of the plating thicknesses of the plated parts is improved.

Description

technical field [0001] The present disclosure relates to the technical field of surface treatment, in particular to a hanger swing device. Background technique [0002] Electroplating is the process of electrodepositing metals or alloys on solid surfaces by electrochemical means. The distribution uniformity of the coating and the stability of the solution are two major topics of concern and research in electroplating production. Among them, the stability of the solution requires uniform distribution of its composition and concentration. However, as the electroplating progresses, the concentration of the solution near the plated parts will decrease, resulting in a large difference in the concentration of the solution in different areas in the electroplating tank, and bubbles may appear on the surface of the plated parts, all of which will affect the electroplating effect. [0003] In the prior art, the stirring of the solution is usually achieved by the reciprocating motion ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C25D21/10
CPCC25D21/10
Inventor 刘博王岩张家瑞王彬汪江浩
Owner SHANDONG TAIKAI HIGH VOLTAGE SWITCH
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