Eureka AIR delivers breakthrough ideas for toughest innovation challenges, trusted by R&D personnel around the world.

Multi-layer circuit board welding device convenient to adjust

A technology of circuit boards and circuit boards, applied in multilayer circuit manufacturing, auxiliary devices, printed circuits, etc., can solve problems such as waste of resources, cost of multilayer circuit boards, and changes in thickness and size of multilayer circuit boards, so as to save equipment costs and improve production efficiency , Easy to operate and install and debug

Active Publication Date: 2019-05-03
安徽米兰电子科技有限公司
View PDF8 Cites 1 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] With the rapid advancement of modern technology, single-sided circuit boards and double-sided circuit boards can no longer meet the needs of too many concentrated lines. Stable output in the case of the situation, but it will also bring new problems, the thickness and size of the multilayer circuit board will change with the designer's requirements during the production process
[0003] At present, the equipment used for the welding of multilayer circuit boards is a custom-made fixed structure equipment, which is only suitable for welding operations of one kind of multilayer circuit board, and the updated multilayer circuit board needs to be redesigned and transformed. Therefore, how to improve the adjustment of multilayer circuit board welding, so that the welding device is suitable for multilayer circuit boards of different sizes and thicknesses, and in the production of different products The production can be adjusted through the adjustable size, which reduces the equipment cost and improves the production efficiency

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Multi-layer circuit board welding device convenient to adjust
  • Multi-layer circuit board welding device convenient to adjust
  • Multi-layer circuit board welding device convenient to adjust

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0036]The technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the embodiments of the present invention. Apparently, the described embodiments are only some of the embodiments of the present invention, not all of them. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without creative efforts fall within the protection scope of the present invention.

[0037] see Figure 1-Figure 7 As shown, the present invention is an easily adjustable multilayer circuit board electric welding device, which includes a support frame 1 and a fixed frame 2, and also includes a linkage mechanism 9, which is installed at one end of the support frame 1, and the linkage mechanism 9 is set Below the circuit board outlet 4, the other end of the support frame 1 is provided with a circuit board inlet 3, and between the circuit board inlet 3 and the circuit...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention discloses a multi-layer circuit board electric welding device convenient to adjust. The multi-layer circuit board electric welding device convenient to adjust comprises a supporting frame, a fixed frame and a linkage mechanism. The linkage mechanism is installed at one end of the supporting frame, the linkage mechanism is arranged under a circuit board outlet, a circuit board inlet is formed in the other end of the supporting frame, and a first welding station, a second welding station, a third welding station and a fourth welding station are installed sequentially between the circuit board inlet and the circuit board outlet. According to the multi-layer circuit board welding device convenient to adjust, the width between conveyor belts is adjusted by ball screws, the heightof a welding structure is adjusted by a swinging arm, the position of a motor is adjusted by a telescopic rod to drive the transmission of the moving conveyor belt and the fixed conveyor belt, the welding device is effectively adjusted from width and thickness to enable the welding device to be suitable for welding of various multi-layer circuit boards, and the equipment cost and production cost are saved.

Description

technical field [0001] The invention relates to the technical field of circuit board manufacturing, in particular to an electric welding device for multilayer circuit boards which is easy to adjust. Background technique [0002] With the rapid advancement of modern technology, single-sided circuit boards and double-sided circuit boards can no longer meet the needs of too many concentrated lines. Stable output under the circumstances, but it will also bring new problems, the thickness and size of the multilayer circuit board will change with the designer's requirements during the production process. [0003] At present, the equipment used for the welding of multilayer circuit boards is a custom-made fixed structure equipment, which is only suitable for welding operations of one kind of multilayer circuit board, and the updated multilayer circuit board needs to be redesigned and transformed. Therefore, how to improve the adjustment of multilayer circuit board welding, so that...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): B23K3/08H05K3/46B23K101/42
Inventor 聂润华
Owner 安徽米兰电子科技有限公司
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Eureka Blog
Learn More
PatSnap group products