Method for controlling excessive glue and solderability of soft and rigid combination board

A technology of flexible and rigid boards and overflowing glue, which is applied in the fields of printed circuit manufacturing, electrical components, and electrical components to assemble printed circuits. Easy to understand, avoid solderability problems, easy to learn and operate

Active Publication Date: 2019-04-26
上海展华电子(南通)有限公司
View PDF8 Cites 1 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Correspondingly, its manufacturing process is more complex
At present, the design of SMT PAD products for the soft board area of ​​the soft-rigid board in the production process of the soft-hard board not only requires strict control of the overflow glue at the junction of the soft-hard board (requirement: the amount of glue overflow ≤ 1.0mm), but also prohibits hairy residues and cover film damage and other appearance defects, and the SMTPAD in the soft board area is prohibited from having solderability problems
The traditional "AD+PI" process will have 10-20% flipping defects and affect the flipping efficiency to a certain extent
If the method of "AD+PI carrier film" can improve the amount of glue overflow at the junction of soft and hard, it may cause the problem of residual glue, and it is necessary to increase the production process to deal with the SMT PAD in the soft board area to prevent solder defects

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Method for controlling excessive glue and solderability of soft and rigid combination board

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0034] As a preferred embodiment of the present invention, the PI carrier film is a slightly sticky PI carrier film.

[0035] In this example, a slightly sticky PI carrier film is used instead of smooth PI, and a piece of PI smaller than the PI carrier film is added at the same time. The viscosity of this PI carrier film must not affect the movement and adjustment during alignment, and it can firmly stick to PI. The edge is in good shape with the soft board, and it is easy to peel off from the surface of the soft board cover film when the cover is lifted.

Embodiment 2

[0037] As a preferred embodiment of the present invention, the edge position of the PI carrier film is attached to the non-punched area of ​​the soft board.

[0038] In this embodiment, the slightly sticky PI carrier film is fixed by AD, and then the PI is fixed by the PI carrier film. The edge position of the slightly sticky PI carrier film is attached to the non-printed PAD area of ​​the soft board to achieve a good shape.

Embodiment 3

[0040] As a preferred embodiment of the present invention, PI is arranged between the PI carrier film and the soft board, and the surface area of ​​the PI is smaller than that of the PI carrier board.

[0041] In this embodiment, a piece of PI smaller than the PI carrier film is added between the PI carrier film and the PAD of the flexible board to separate the PI carrier film from the SMT pad in the soft board area, and avoid the problem of poor solderability caused by residual glue.

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

PUM

No PUM Login to view more

Abstract

The invention discloses a method for controlling excessive glue and solderability of a soft and rigid combination board. According to the method, a method combining AD, PI carrier film and PI preventsAD glue from permeating the position between the micro-adhesive PI carrier film and a soft board, and also prevents the micro-adhesive PI carrier film from being in direct contact with a soft board positioning PAD, one time of fitting is added on the basis of 'AD + PI', the principle is easy to understand, a step is added compared with the operation mode in the past, and an employee learns and operates the method easily; an existing 'AD + PI' method always has the problems that excessive glue exists, scrapping can be generated, and the quality problem such as scratches can occur when residuesare removed through a scalpel, the method for controlling the excessive glue and solderability of the soft and rigid combination board has the advantages that the AD glue is prevented from permeatingthe position between the micro-adhesive PI carrier film and the soft board, the problem of low efficiency caused by upper cover adhesion is prevented, and no production process needs to be added to treat a soft board area, so that the problems are avoided that the existing method always has the problem of excessive glue, and a worker needs to spend a lot of time in removing the residues with thescalpel after opening a cover.

Description

technical field [0001] The invention relates to the technical field of semiconductor manufacturing, in particular to a method for controlling glue overflow and solderability of a rigid-flex board. Background technique [0002] Rigid-flex board has the characteristics of both FPC and PCB. Therefore, it can be used in some products with special requirements. It has both a certain flexible area and a certain rigid area, which can save the internal space of the product and reduce the volume of the finished product. , It is of great help to improve product performance. Correspondingly, its manufacturing process is also more complicated. At present, the design of SMT PAD products for the soft board area of ​​the soft-rigid board in the production process of the soft-hard board not only requires strict control of the overflow glue at the junction of the soft-hard board (requirement: the amount of glue overflow ≤ 1.0mm), but also prohibits hairy residues and cover film damage and ...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Application Information

Patent Timeline
no application Login to view more
Patent Type & Authority Applications(China)
IPC IPC(8): H05K3/00H05K3/36
CPCH05K3/0011H05K3/361
Inventor 孙书勇
Owner 上海展华电子(南通)有限公司
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap