Flexible electronics preparing, transferring, and packaging system and method
A packaging system and flexible technology, applied to circuits, electrical components, transportation and packaging, etc., can solve the problems of large system volume and low automation level, and achieve the effect of reducing volume, improving production efficiency and reducing intermediate links
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[0044] In order to make the object, technical solution and advantages of the present invention clearer, the present invention will be further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described here are only used to explain the present invention, not to limit the present invention. In addition, the technical features involved in the various embodiments of the present invention described below can be combined with each other as long as they do not constitute a conflict with each other.
[0045] Such as figure 1 As shown, a flexible electronic preparation, transfer and packaging system provided by the embodiment of the present invention mainly includes a substrate transfer module 100, a flexible electronic preparation module 200, a laser lift-off module 300, and a packaging and loading and unloading module 400, wherein the substrate transfer The module 100 is used to pick up the...
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