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Flexible electronics preparing, transferring, and packaging system and method

A packaging system and flexible technology, applied to circuits, electrical components, transportation and packaging, etc., can solve the problems of large system volume and low automation level, and achieve the effect of reducing volume, improving production efficiency and reducing intermediate links

Active Publication Date: 2016-07-13
武汉国创科光电装备有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] At present, there are more and more researches on the process and system of flexible electronic device manufacturing, but some of the current manufacturing systems require manual operation, and their automation level is not high; some of them use fully automatic preparation systems, but each module Relatively independent, resulting in a bulky system; in addition, because flexible electronics are very thin and soft, more complicated methods are required for the transfer and storage of flexible electronics

Method used

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Embodiment Construction

[0044] In order to make the object, technical solution and advantages of the present invention clearer, the present invention will be further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described here are only used to explain the present invention, not to limit the present invention. In addition, the technical features involved in the various embodiments of the present invention described below can be combined with each other as long as they do not constitute a conflict with each other.

[0045] Such as figure 1 As shown, a flexible electronic preparation, transfer and packaging system provided by the embodiment of the present invention mainly includes a substrate transfer module 100, a flexible electronic preparation module 200, a laser lift-off module 300, and a packaging and loading and unloading module 400, wherein the substrate transfer The module 100 is used to pick up the...

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PUM

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Abstract

The invention discloses a flexible electronics preparing, transferring, and packaging system and method. The system comprises a substrate transferring module, a flexible electronics preparing module, a laser stripping module, and a packaging, loading and unloading module. The substrate transferring module is used for picking up a substrate and placing the substrate on the flexible electronics preparing module, and transferring prepared flexible electronic device and the substrate to the laser stripping module, and finally reclaims the stripped substrate from the laser stripping module. The flexible electronics preparing module is used for preparing the flexible electronic device on the substrate. The laser stripping module is used for stripping the prepared flexible electronics off the substrate. The packaging, loading and unloading module is used for placing a product to be packaged on a packaging module, packages the flexible electronics stripped from the substrate on the product, and taking down the packaged product. The method prepares, transfers, and packages the flexible electronic device by using the system. The system is greatly decreased in size, reduces intermediate links, saves space, and increases production efficiency.

Description

technical field [0001] The invention belongs to the field of flexible device manufacturing, and more specifically relates to a flexible electronic preparation, transfer and packaging system and method. Background technique [0002] Flexible electronics, also known as printed electronics or organic electronics, is a technology that deposits organic / inorganic electronic devices on flexible substrates to form circuits. Since the performance of flexible electronics is equivalent to that of traditional microelectronics, and it has the characteristics of portability, transparency, light weight, stretch / bend, and easy rapid large-area printing, many new applications have been generated, such as flexible displays, thin-film solar cells, large-area sensors and actuators, etc. The flexible electronics manufacturing process usually includes material preparation, deposition, patterning, and packaging. Flexible electronics manufacturing mainly focuses on factors such as production cost,...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/67H01L21/677H01L21/50
CPCH01L21/67011H01L21/50H01L21/67121H01L21/67703
Inventor 陈建魁刘腾尹周平黄永安
Owner 武汉国创科光电装备有限公司
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