Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Circuit width thinning defect prevention device and method of preventing circuit width thinning defect

A technology for changing circuit width and devices, which is applied to printed circuits, measuring devices, and chemical/electrolytic methods to remove conductive materials, etc., and can solve problems such as circuit width thinning

Active Publication Date: 2014-07-09
SAMSUNG ELECTRO MECHANICS CO LTD
View PDF4 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0017] This circuit width narrowing defect according to the reduction of circuit width has become a serious problem

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Circuit width thinning defect prevention device and method of preventing circuit width thinning defect
  • Circuit width thinning defect prevention device and method of preventing circuit width thinning defect
  • Circuit width thinning defect prevention device and method of preventing circuit width thinning defect

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0042] The advantages and features of the present invention and the method for realizing the present invention will be apparent by referring to the following embodiments described in detail with reference to the accompanying drawings. However, the present invention is not limited to the embodiments disclosed below and may be implemented in various forms. These embodiments are provided only to complete the disclosure of the invention and to fully convey the scope of the invention to those skilled in the art. Throughout this specification, the same reference numerals refer to the same elements.

[0043] The terms used herein are used to describe the embodiments, not to limit the present invention. Throughout this specification, unless the context clearly indicates otherwise, the singular form includes the plural form, and the term "comprises" and / or "comprises" used herein does not exclude other than the above-mentioned components, steps, operations and / or means. The presence ...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The present invention relates to a circuit width thinning defect prevention device and a method of preventing a circuit width thinning defect, and can prevent a circuit width thinning defect, that is, a reduction in circuit width due to excessive etching on a specific portion by including a storage means for storing dam design information classified according to the type of a weak portion; an analysis means for analyzing first design information to deduce the type and position of the weak portion; a matching means for extracting the dam design information corresponding to the type of the weak portion from the dam design information stored in the storage means; and a change means for changing the first design information to add a dam according to the dam design information extracted by the matching means to the position of the weak portion deduced by the analysis means.

Description

[0001] Cross References to Related Applications [0002] This application claims the benefit of Korean Patent Application No. 10-2012-0158336 filed on December 31, 2012, the entire contents of which are incorporated herein by reference. technical field [0003] The invention relates to a circuit width narrowing defect prevention device and a method for preventing circuit width narrowing defects. Background technique [0004] One method widely used in the field of printed circuit boards is the capping method. [0005] The capping method is a method of forming a circuit pattern by forming a resist pattern on the surface of a conductive layer using a dry film etc. The conductive layer in the region outside the resist pattern), and the resist pattern is removed, and this capping method is introduced in many documents such as Patent Document 1. [0006] Recently, with increasing demand for slimming and miniaturization and high performance of electronic devices, fine patterns ar...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): H05K3/06
CPCG06F30/398G01B11/046G01B2210/58G01N2021/95638H05K13/08H05K2203/163
Inventor 成定庆丘奉完赵元佑
Owner SAMSUNG ELECTRO MECHANICS CO LTD
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com