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Measuring probe for measuring the thickness of thin layers, and method for the production of a sensor element for the measuring probe

A technology of sensor elements and measuring probes, applied in measuring devices, electromagnetic measuring devices, electric/magnetic thickness measurement, etc., can solve the problems of reduced measurement sensitivity, excessive space, and reduced measurement accuracy, so as to improve wear resistance, Effects of high resolution and improved measurement sensitivity

Active Publication Date: 2014-04-02
HELMUT FISCHER & INSTITUT FUR ELECTRONIK & MESSTECHN
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Since the measuring element is positioned at a distance from the object to be measured, this has too much space, whereby the measurement sensitivity is reduced and thus the measurement accuracy is reduced

Method used

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  • Measuring probe for measuring the thickness of thin layers, and method for the production of a sensor element for the measuring probe
  • Measuring probe for measuring the thickness of thin layers, and method for the production of a sensor element for the measuring probe
  • Measuring probe for measuring the thickness of thin layers, and method for the production of a sensor element for the measuring probe

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Embodiment Construction

[0043] figure 1 A cross-sectional view of a measuring probe 11 for a device, not shown in more detail, for measuring the thickness of thin layers is schematically depicted in . The measuring probe 11 is used for the non-destructive measurement of the layer thickness. According to an exemplary embodiment, this measuring probe 11 may be provided separately from the data processing means of the device for measuring the thickness of the thin layer and the recorded value may be transmitted via the connecting cable 12 or wirelessly. Alternatively, the measuring probe 11 may be part of a device for measuring the thickness of thin layers in the form of a stationary device or a hand-held device.

[0044] The measuring probe 11 has a housing 14 which is in particular cylindrically formed. At least one sensor element 17 is preferably arranged along the longitudinal axis 16 of the housing 14 . The sensor element 17 is carried by a holding element 18 which is accommodated on an end sect...

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Abstract

The invention relates to a measuring probe for measuring the thickness of thin layers, comprising a housing (14), at least one sensor element (17) which is accommodated so as to be at least slightly movable along a longitudinal axis (16) within the housing (14) and which comprises at least one coil device (44) associated with the longitudinal axis (16), and a spherical positioning cap (21) which points in the direction of the outer face of the housing (14), is arranged along the longitudinal axis (16), and has a base (55) that includes a cylindrical core section (56) and a pole cap (58) arranged on a face of the core section (56). The coil device (44), which is formed of a disk-shaped or ring-shaped support (49) with at least one Archimedean coil arranged thereon, is associated with the spherical positioning cap (21). The base (55) is made of a ferritic material while the pole cap is made of hard metal.

Description

technical field [0001] The invention relates to a measuring probe for measuring the thickness of thin layers and a method for producing a sensor element for the measuring probe according to the respective preambles of the independent claims. Background technique [0002] A measuring probe for measuring the thickness of thin layers is known from DE 10 2005 054 593 A1. The measuring probe comprises a housing in which at least one sensor element is arranged, the sensor element being received in the housing at least slightly displaceable along the longitudinal axis of the housing. The sensor element comprises at least one first winding arrangement and at least one second winding arrangement housed by a pot core. The pot-shaped core includes a central pin, and a spherical positioning cover is arranged on the end of the central pin facing the shell. The pot-shaped core with the sensor element disposed thereon and the spherical positioning cap is received by a resiliently flexibl...

Claims

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Application Information

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IPC IPC(8): G01N27/90G01B7/06
CPCG01B7/105G01B7/10Y10T29/49071
Inventor H.菲舍尔
Owner HELMUT FISCHER & INSTITUT FUR ELECTRONIK & MESSTECHN
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