Wafer tensioning device for semiconductor packaging

Abstract

The invention relates to a wafer tensioning device for semiconductor packaging. The wafer tensioning device for semiconductor packaging comprises a wafer tensioning base and a downward-pressing cover plate, wherein a first cavity is formed inside the wafer tensioning base, a wafer tensioning bearing protruding ring is arranged on the wafer tensioning base, a second cavity is formed inside the wafer tensioning bearing protruding ring, the diameter of the second cavity is equal to that of the first cavity, the outer diameter of the wafer tensioning bearing protruding ring is smaller than that of the wafer tensioning base, the downward-pressing cover plate is connected with the wafer tensioning base through a hinge, and is used in cooperation with the wafer tensioning base, a third cavity is formed inside the downward-pressing cover plate, the diameter of the third cavity is larger than the outer diameter of the wafer tensioning bearing protruding ring, and the downward-pressing cover plate is arranged on the wafer tensioning bearing protruding ring in a sleeved mode through the third cavity. The wafer tensioning device for semiconductor packaging has the advantages of being simple in structure, safe, reliable, high in working efficiency and wide in range of wafer tensioning.

Description

technical field [0001] The invention relates to a stretch sheet device for semiconductor packaging. Background technique [0002] In the semiconductor packaging die bonding process, the stretcher structure is a very important hardware configuration on the die bonding equipment. The integrity of the stretcher structure plays a leading role in the efficiency and quality of the die bonding. [0003] In the traditional stretcher device, the wafer of the chip must be expanded through the wafer expansion structure before use. When expanding, first fix the disk in two embedded plastic rings, then place the rings in the expansion structure of the disk, and then stick the disk. This type of stretcher structure not only takes up manpower and increases the process, but at the same time, because the stretcher ring is a plastic structure, the metal changer ring commonly used in the field of semiconductor packaging bonding cannot be used. In addition, the stretcher structure can only 5-...

AI Technical Summary

Problems solved by technology

This type of stretcher structure not only takes up manpower, but also increases the process. At the same time, because the stretcher ring is a plastic structure, the metal change ring commonly used in the field of semiconductor packaging bonding cannot be used. In addition, the stretcher structure can only be used at most. 5-inch wafers are produced, larger than 5 inches, such as 6-inch wafers cannot be operated; at the same time, the existing stretcher device is easy to slide during the operation process, resulting in uneven stretching of the wafer and insufficient chip placement Accurate and other defects

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