Aluminum substrate film splicing manufacture method
A manufacturing method and technology for aluminum substrates, which are applied in printed circuit manufacturing, electrical components, printed circuits, etc., can solve the problems of unstable exposure accuracy at the interface, easy poor exposure, and large manpower and material resources, and achieve dimensional accuracy control. Expose quality problems and avoid the effects of human and material resources
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[0024] The present invention provides a film splicing method for an aluminum substrate. In order to make the purpose, technical solution and effect of the present invention clearer and clearer, the present invention will be further described in detail below. It should be understood that the specific embodiments described herein are only used to explain the present invention, but not to limit the present invention.
[0025] see figure 1 , which is a flow chart of the film splicing method for aluminum substrates of the present invention. As shown in the figure, the aluminum substrate film splicing manufacturing method is used for pattern transfer on a 1250mm aluminum substrate, wherein the method includes the following steps:
[0026] S1. Divide the design drawing into two parts of the film: the first part and the second part. The graphics of the first part and the second part need to be 5mm-10mm more than the dividing line to produce the film, and design the alignment graphics...
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