Substrate conveying apparatus and method

Abstract

The invention provides a substrate conveying apparatus and method. The substrate conveying apparatus comprises the following components: a spaced rotary drive source (9) provided with a pair of guide rails (1), a workbench (3) supporting the lower portion of the substrate at two end portions in the width direction supported by the pair of guide rails, a nozzle body (19) that makes the positive / negative air pressure work on the end face in the width direction of the workbench between the guide rails, a pressure sensor (24) used for detecting the pressure changes of the gas resulting from the interval change of the nozzle body and the side face of the workbench by making the air pressure work on the side face of the replaced workbench and driving the guide rails equipped with the nozzle body in the direction approaching the side face of the workbench, when the substrate size is changed and the workbench is changed into a workbench having different width size, and a control apparatus used for detecting the pressure changes of the gas flowing through the nozzle body via a pressure sensor, controlling the driving of a rotary drive source, and setting the space for a pair of guide rails.

Description

technical field [0001] The invention relates to a substrate conveying device and a conveying method for conveying and positioning a substrate along a pair of guide rails. Background technique [0002] For example, when electronic components such as IC chips are mounted on a substrate, the substrate is conveyed along guide rails to a mounting position where a mounting stage is provided, and if the lower surface of the substrate is supported by the stage at the mounting position , the above-mentioned electronic component is mounted on the upper surface of the above-mentioned substrate by using a mounting tool. [0003] The substrate is supported at both ends in the width direction by a pair of guide rails parallel to each other, and is intermittently conveyed at predetermined distances along the guide rails by, for example, a transfer mechanism such as a chuck mechanism. [0004] When mounting the above-mentioned electronic components on the above-mentioned substrate, the mou...

AI Technical Summary

Problems solved by technology

[0014] However, when the interval adjustment of the pair of guide rails and the positioning adjustment of the table relative to the pair of guide rails are performed, work mistakes may occur, or a table of the wrong size may be assembled.

[0015] If the above-mentioned table is mistaken for a table larger than the size to be replaced, the table and the guide rail will interfere, and if the table is mistaken for a small table on the contrary, the end of the width direction of the table will The distance from the guide rail is too large, and the entire width direction of the substrate cannot be reliably supported, so it is impossible to securely mount multiple electronic components at a predetermined interval with respect to the width direction of the substrate

[0016] In addition, the above-mentioned operational errors during the interval adjustment of the guide rails are not limited to the case of changing the size of the substrate, and may also occur when adjusting the substrate for the first conveyance.

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