Cover tape and method for manufacture

Abstract

An article includes a cover tape, which includes a base film layer, tear enabling features, and an adhesive. The base film layer has opposed longitudinal edges and top and bottom surfaces. The tear enabling features are substantially parallel to the longitudinal edges and at the top and bottom surfaces.

Description

[0001] This patent application is a continuation-in-part of co-pending US patent application 11 / 228956, filed September 16, 2005, which is incorporated by reference. technical field [0002] The invention relates to a tape carrying components. Background technique [0003] In a manufacturing environment, there is often a need to grip and transport components. For example, in the art of electronic circuit assembly, it is often necessary to transport electronic components from a component supply to a specific location on a circuit board to be attached. Components may be of many different types, including surface mount components. Specific examples include memory chips, integrated circuit chips, resistors, connectors, processors, capacitors, gate arrays, and the like. Small precision components can be transported using a carrier tape / cover tape system such as that disclosed in US Patent No. 5,325,654. [0004] As the electronics industry continues to move toward smaller devi...

AI Technical Summary

Problems solved by technology

Even though cover tapes are advertised for use with different types of carrier tapes, they may still have suboptimal peel force and uneven peel

In addition, HAA cover tapes are less stable as peel force decreases over time and temperature

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