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High frequency and high current usb socket

A high-current, high-frequency technology, applied in the direction of circuits, electrical components, coupling devices, etc., can solve problems such as missing, unable to achieve high-frequency transmission, etc., and achieve the effect of high-power power transmission

Active Publication Date: 2020-07-24
SHENZHEN EVERWIN PRECISION TECH
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  • Claims
  • Application Information

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Problems solved by technology

What this structure sacrifices is the high-frequency transmission performance of the socket, because the shielding of the middle board is missing between high-frequency signals, and high-frequency transmission cannot be achieved

Method used

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  • High frequency and high current usb socket
  • High frequency and high current usb socket
  • High frequency and high current usb socket

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Embodiment Construction

[0025] In order to make the purpose, technical solution and advantages of the present application clearer, the technical solution of the present application will be clearly and completely described below in conjunction with specific embodiments of the present application and corresponding drawings. Apparently, the described embodiments are only some of the embodiments of the present application, rather than all the embodiments. Based on the embodiments in this application, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the scope of protection of this application.

[0026] see figure 1 , figure 2 As shown, the high-frequency and high-current USB socket of the present application includes a middle board 40, first and second terminal groups 20, 30 respectively located on the upper and lower sides of the middle board 40, and connecting the middle board 40 and the first , The second terminal group 20 , 30 is forme...

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Abstract

A high-frequency and large-current USB socket comprises an intermediate plate, a first terminal group, a second terminal group and an insulation body, wherein the first terminal group and the second terminal group are respectively arranged at an upper side and a lower side of the intermediate plate, the insulation body is used for integrating the intermediate plate, the first terminal group and the second terminal group, the first terminal group and the second terminal group respectively and sequentially comprises a grounding terminal, a high-frequency signal terminal, a power terminal, a conventional signal terminal, a power terminal, a high-frequency signal terminal and a grounding terminal in a horizontal direction, the thicknesses of the grounding terminal and the power terminal are higher than the terminal thicknesses of the high-frequency signal terminal and the conventional signal terminal, a part, arranged between the power terminal and the conventional signal terminal, of theintermediate plate is cut to form a left block and a right block, each intermediate plate comprises a main body plate part and a protruding part, the main body plate part is arranged between the high-frequency signal terminals, and the protruding part extends from a front end of the main body plate part to a horizontal outer side. The high-frequency and large-current USB socket is used for supporting high-frequency transmission and high-power transmission.

Description

technical field [0001] The application relates to the field of electrical connectors, in particular to a high-frequency and high-current USB socket. Background technique [0002] The existing USB3.1 Type C socket generally includes a middle board and first and second terminal groups respectively arranged on the upper and lower sides of the middle board. In the standard of the association, the standard for power transmission is only 2A, and the current smart phones basically need to be charged with a large current. Therefore, the standard structure can no longer meet the needs of the market. And there are several different types of high-current versions, that is, the middle part of the middle board is cut off, and the outer part of the middle board is left directly in contact with the ground terminal for grounding. However, this structure sacrifices the high-frequency transmission performance of the socket, because the shielding of the mid-plane is missing between high-frequ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01R13/02H01R13/652H01R13/6585H01R13/627H01R13/502
CPCH01R13/02H01R13/502H01R13/627H01R13/652H01R13/6585
Inventor 张秀华
Owner SHENZHEN EVERWIN PRECISION TECH
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