Sensor

Abstract

The invention discloses a sensor which comprises a circuit board. A pressure core body is bound on the circuit board through an electric lead, an electric conductor is connected to the outer portion of the pressure core body, and the circuit board is a ceramic circuit board using ceramics as a base plate. The sensor adopts the ceramic circuit board using the ceramics as the base plate. Due to the fact that the thermal expansion coefficient of the ceramics is close to the thermal expansion coefficient of the pressure core body, pressure core body deformation affected by circuit board deformation caused by different thermal expansion coefficients of the ceramics and the pressure core body is avoided so as to guarantee that sensors at different temperature ranges have reliable accuracy. Simultaneously, the ceramic circuit board using the ceramics as the base plate is a conventional circuit board, is low in cost, facilitates large scale production, and can effectively lower product cost.

Description

technical field [0001] The invention relates to a sensor, in particular to a sensor for measuring pressure. Background technique [0002] The Chinese invention patent application with the application number 201110334291.4 and titled "composite temperature and pressure sensor" discloses a sensor that uses electrical principles to measure temperature and pressure, including a base with a groove on the top, fixed on the base by a pressure ring The corrugated diaphragm on the top of the seat, the groove of the base and the corrugated diaphragm are filled with silicone oil, and the pressure chip is arranged in the base. The pressure chip is connected to the lead electrode through a gold wire, and the lead electrode passes through the base and protrudes. A thermistor is also fixed in the base, and the oil inlet hole on the base is sealed by a pin, which can measure pressure and temperature at the same time, and realize the isolation of the pressure sensing chip through a stainless...

AI Technical Summary

Problems solved by technology

However, there are still disadvantages in the above-mentioned technical solution

Due to the technical means of filling silicone oil and using metal as the substrate, there is a large gap between the thermal expansion coefficient of the metal and the expansion coefficient of the silicon chip, which limits the scope of use of the sensor.

For example, the sensors used in automobiles are required to work normally in the temperature range of -40 degrees Celsius to +125 degrees Celsius. Due to the different thermal expansion coefficients of the two, in different temperature ranges, the metal expansion will affect the deformation of the silicon chip, resulting in The measurement error value is too large

Images