Heat exchanger apparatus and methods of manufacturing cross reference

Abstract

The invention provides systems and methods for cooling semiconductor devices, such as those provided in concentrated photovoltaic (CPV) systems using a cold plate. The invention also provides using a material, such as a ceramic, to form that cold plate that matches or nearly matches the coefficient of thermal expansion (CTE) of a photovoltaic cell. Additionally, the cooling system may include fluidic passageways through which a fluid may flow, which may result in a transfer of heat between the fluid and the solid structure.

Description

CROSS REFERENCE[0001]This application claims the benefit of priority to U.S. Provisional Patent Application No. 61 / 116,637 filed on Nov. 20, 2008, which is incorporated herein by reference in its entirety.BACKGROUND OF THE INVENTION[0002]Solar cells have been used to convert solar energy into other forms of energy, such as electrical energy or thermal energy. Solar cells may be interconnected and may be bonded to a substrate to form a receiver. In some instances, concentrated photovoltaic (CPV) solar receivers may receive concentrated solar energy, which may be concentrated by optics and / or the reflection of solar energy from multiple reflective surfaces. In such situations, CPV receivers may generate electricity proportionally to the light flux they receive. Their efficiency is reduced as temperature increases. For example, solar cells that reach a temperature higher than 60 degrees Celsius lose between 10.5% and 17.5% of the power versus power generated at 25 degrees Celsius. A so...

AI Technical Summary

Benefits of technology

[0007]Another aspect of the invention provides for cold plate configurations and arrangements. Fluidic passages may be arranged through the cold plate such that heat may be effectively transferred from a solid structure to a fluid flowing within the cold plate or vice versa. A cold plate may be formed of layers that may include slots and / or holes that may form the fluidic passages. A cold plate may utilize three-dimensional fluid flow to effectively transfer heat.

Problems solved by technology

However, the use of such a dielectric layer requires a large number of critical thermal interfaces and large area thermal interface materials.

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