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Modified epoxy resin, epoxy-based pressure plate and manufacturing method of epoxy-based pressure plate

A technology of epoxy resin and production method, which is applied in the direction of synthetic resin layered products, chemical instruments and methods, layered products, etc., can solve the problems of low cost, epoxy-based laminates cannot have heat resistance, etc., and achieve reduction Cost, improvement of poor temperature resistance, effect of heat resistance improvement

Pending Publication Date: 2022-07-01
LUOYANG INST OF CUTTING EDGE TECH +1
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0004] The main purpose of the present invention is to provide a modified epoxy resin, an epoxy-based laminate and a manufacturing method thereof, so as to solve the problem that the epoxy-based laminate cannot have both heat resistance and low cost in the prior art

Method used

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  • Modified epoxy resin, epoxy-based pressure plate and manufacturing method of epoxy-based pressure plate
  • Modified epoxy resin, epoxy-based pressure plate and manufacturing method of epoxy-based pressure plate

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preparation example Construction

[0027] In a preferred embodiment, the above-mentioned hydroxyl-terminated hyperbranched polyphenylene ether-modified boron nitride nanosheets are prepared by the following method: the first solution in which the boron nitride nanosheets are dispersed is mixed with hydroxyl-terminated hyperbranched polyphenylene ether. Mixing, so that the hydroxyl-terminated hyperbranched polyphenylene ether is modified on the surface of the boron nitride nanosheets to obtain a first mixed solution; the first mixed solution is solid-liquid separated to obtain the hydroxyl-terminated hyperbranched polyphenylene ether modified boron nitride nanometer sheet piece.

[0028] In the above preferred embodiment, the solvent for dispersing the boron nitride nanosheets can be N-methylpyrrolidone solution (NMP solution). In order to improve the dispersibility of the boron nitride nanosheets in the solvent, the boron nitride nanosheets can be Ultrasonic treatment in solvent.

[0029] Before the step of di...

Embodiment 1

[0041] The present embodiment provides a manufacturing method of an epoxy-based laminate, comprising the following steps:

[0042] Step 1: Preparation of Surface-Modified Boron Nitride Nanosheets

[0043] Weigh 5g of boron nitride powder in 100ml of NMP solution, stir and ultrasonicate for 8h, centrifuge the treated mixed solution in a centrifuge at 8000 rpm, remove the unstripped boron nitride powder in the lower layer, collect the upper layer of mixed solution, and put the hyperbranched solution. The hydroxyl-terminated polyphenylene ether is dispersed into the supernatant liquid, fully mixed, and dried to obtain the final powder after suction filtration.

[0044] Step 2: Preparation of Epoxy Laminate

[0045] Weigh an appropriate amount of cyanate monomer (Yangzhou Tianqi New Materials, bisphenol A cyanate monomer, C01MO), heat and melt at 100 ° C, and heat and melt the hydroxyl-terminated hyperbranched polyphenylene ether modified boron nitride in step 1. The powder is a...

Embodiment 2

[0049] The difference between the manufacturing method of the epoxy-based laminate provided in this embodiment and Embodiment 1 is:

[0050] The weight ratio of surface-modified boron nitride powder, cyanate ester monomer and epoxy resin is 1:1:18.

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Abstract

The invention provides modified epoxy resin, an epoxy-based pressure plate and a manufacturing method of the epoxy-based pressure plate. The modified epoxy resin comprises an interpenetrating network of a cyanate ester polymer and epoxy resin, and further comprises hydroxyl-terminated hyperbranched polyphenyl ether modified boron nitride nanosheets dispersed in the interpenetrating network. The modified epoxy resin is an interpenetrating network of a cyanate ester polymer and epoxy resin, and is formed by modifying the epoxy resin through the modified boron nitride nanosheet and a cyanate ester monomer according to a certain proportion, and the heat conductivity coefficient of boron nitride is relatively high; amino groups and hydroxyl groups existing at lattice defects of boron nitride are modified by adopting hydroxyl-terminated hyperbranched polyphenyl ether, so that the modified epoxy resin can be improved in the aspects of heat conduction performance and heat resistance, the problem of poor temperature resistance of a traditional epoxy copper-clad plate material is solved, the application requirement of the 5G field is met, and meanwhile, the service life of the copper-clad plate material is prolonged. And the product cost is reduced.

Description

technical field [0001] The present invention relates to the technical field of epoxy resin modification, in particular, to a modified epoxy resin, an epoxy-based laminate and a manufacturing method thereof. Background technique [0002] With the continuous development of printed circuit boards (PCBs) towards high density and multi-layering, the space for components to be mounted and installed on the PCB is greatly reduced, and the power requirements of power components for complete electronic products are getting higher and higher. Small space and high power inevitably generate more heat accumulation, resulting in electrical performance degradation or even damage to components. [0003] Epoxy copper clad laminate is currently the most widely used in the market, but it is limited due to its poor heat resistance and low heat transfer efficiency. With the advent of 5G, the development of new copper clad laminates (such as PTFE, hydrocarbon copper clad laminates, etc.) has grad...

Claims

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Application Information

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IPC IPC(8): C08L63/00C08L79/04C08K9/04C08K7/00C08K3/38C08K7/14C09K5/14B32B27/38B32B27/06
CPCC08L63/00C09K5/14B32B27/38B32B27/08C08K2201/011C08K2003/285C08L2205/04C08L2201/08C08L79/04C08K9/08C08K7/00C08K3/38C08K7/14
Inventor 刘若鹏赵治亚侯燕
Owner LUOYANG INST OF CUTTING EDGE TECH
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