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Low-dielectric high-insulating-strength polyimide film and preparation method thereof

A polyimide film, high dielectric strength technology, applied in the field of polyimide materials, can solve problems such as dielectric performance improvement, and achieve the effect of narrowing the layer spacing and good mechanical properties

Pending Publication Date: 2021-08-10
GUILIN ELECTRICAL EQUIP SCI RES INST
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Adding reinforcing fillers (such as silicon dioxide, etc.) is a common method to improve the mechanical properties of porous films, such as the invention patent with the publication number CN104910409A, the tensile strength of the porous membrane with reinforcing fillers is significantly better than that of the example without reinforcing fillers , but the addition of reinforcing fillers also leads to the improvement of the dielectric properties

Method used

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  • Low-dielectric high-insulating-strength polyimide film and preparation method thereof
  • Low-dielectric high-insulating-strength polyimide film and preparation method thereof
  • Low-dielectric high-insulating-strength polyimide film and preparation method thereof

Examples

Experimental program
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Effect test

Embodiment 1

[0049] 1) In a nitrogen atmosphere, control the temperature of the synthesis system at 12°C, add 640.00kg N,N'-dimethylacetamide (DMAC) to the reactor, and then add 50.837kg 3,4'-diaminodiphenyl ether ( 3,4'-ODA), after stirring and dissolving, add dianhydride 3,3',4,4'-biphenyltetracarboxylic dianhydride (s-BPDA, 29.878kg, added in 4 times), 2,2-bis[4-(3,4-dicarboxyphenoxy)phenyl]propane dianhydride (BPADA, 79.285kg, added in 8 times), stirred for 36h, Obtain a polyamic acid resin solution with a solid content of 20 wt% (solid content in the solution (abbreviated as M, the same below)=160.0kg);

[0050] 2) keep polyamic acid resin solution 15 ℃, add silver nitrate dispersion liquid (silver nitrate concentration is 12wt%), aluminum nitrate dispersion liquid (aluminum nitrate concentration is 8wt%) wherein, the add-on of described silver nitrate dispersion liquid is Control the add-on of silver nitrate to be 2.5wt% of polyamic acid resin solution solid content, the add-on of d...

Embodiment 2

[0070] The difference between this embodiment and Example 1 is that in step 2), the addition of the silver nitrate dispersion is to control the addition of silver nitrate to be 10.0wt% of the solid content of the polyamic acid resin solution; The added amount is to control the added amount of aluminum nitrate to be 5.0wt% of the solid content of the polyamic acid resin solution. Bubbles are uniformly distributed inside the obtained film, and holes are formed on the surface of the film.

Embodiment 3

[0072] The difference between this embodiment and Example 1 is that in step 2), the addition of the silver nitrate dispersion is to control the addition of silver nitrate to be 0.1wt% of the solid content of the polyamic acid resin solution; The added amount is to control the added amount of aluminum nitrate to be 1.0 wt% of the solid content of the polyamic acid resin solution. Bubbles are uniformly distributed inside the obtained film, and holes are formed on the surface of the film.

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Abstract

The invention discloses a low-dielectric high-insulating-strength polyimide film and a preparation method thereof. The preparation method of the film comprises the following steps: preparing a polyamide acid resin solution; and then adding the silver salt dispersion liquid and the reinforcing filler dispersion liquid into the polyamide acid resin solution, uniformly mixing, and carrying out constant-temperature thermal decomposition, imidization and sizing treatment on the obtained mixed resin solution after salivation and film formation, so as to obtain the polyamide acid film, wherein the silver salt dispersion liquid and the reinforcing filler dispersion liquid are respectively solutions formed by respectively dispersing silver salt and reinforcing filler in a polar aprotic solvent, the addition amounts of the silver salt dispersion liquid and the reinforcing filler dispersion liquid are respectively 0.1-10 wt% and 0.5-8.5 wt% of the solid content of the polyamide acid resin solution, the constant-temperature thermal decomposition treatment is performed under the condition of 190-220 DEG C, and the decomposition time is longer than or equal to 5 minutes. The film prepared by adopting the method disclosed by the invention not only has relatively low dielectric property, but also has relatively high mechanical property and insulating strength.

Description

technical field [0001] The invention relates to polyimide materials, in particular to a polyimide film with low dielectric and high dielectric strength and a preparation method thereof. Background technique [0002] Polyimide (PI) films are widely used as dielectric materials in the microelectronics industry due to their excellent high temperature resistance, chemical resistance, mechanical properties and electrical properties. The molecular chains of ordinary PI films are polar chains, and the dielectric constant (Dk) is usually 3.2-3.8. [0003] With the rapid development of the microelectronics industry, the functions of microelectronic components are constantly increasing while the volume is constantly decreasing. The integration of VLSI is getting higher and higher, and the size is gradually decreasing. The effect is also becoming more and more serious, and the resistance and capacitance delay of metal interconnection increase with nearly quadratic power, resulting in ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08J5/18C08L79/08C08K3/08C08K3/22
CPCC08J5/18C08J2379/08C08K2201/011C08K2003/0806C08K2003/2227C08K2003/2296C08K2003/222
Inventor 任小龙王振宇朱凌云汪英
Owner GUILIN ELECTRICAL EQUIP SCI RES INST
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