Electronic device

Abstract

The embodiment of the invention relates to the technical field of heat dissipation, and particularly discloses an electronic device which comprises a shell, a heating element, a centrifugal fan and a flow guide assembly. The shell is provided with an accommodating space, and the shell has a heat-conducting property; the heating element is located in the accommodating space, the heating element is installed on the inner surface of the shell, and the heat generated when the heating element works is conducted to the shell; the centrifugal fan is mounted on the outer surface of the shell; the flow guide assembly is arranged on the outer surface of the shell and is provided with a plurality of heat dissipation channels, the heat dissipation channels are distributed around the centrifugal fan, and wind generated by the centrifugal fan can be dispersed through the heat dissipation channels, wherein the shapes of the plurality of heat dissipation channels are the same as the flow field of the wind generated by the centrifugal fan. Through the above mode, the embodiment of the invention can realize smaller wind resistance and a good heat dissipation effect in a limited thickness space.

Description

technical field [0001] Embodiments of the present invention relate to the technical field of heat dissipation, and in particular, to an electronic device. Background technique [0002] With the development of power modules, the power consumption of its internal components is getting higher and higher, and the structure requirements are also becoming more and more compact. In the technical field of vehicle power supply and drive, the product size is small, the power density is relatively high, and natural heat dissipation cannot meet the requirements. Therefore, forced air cooling or liquid cooling is generally used to solve the problem of heat dissipation of internal power devices. [0003] However, in the process of implementing the embodiments of the present invention, the inventors found that: the current vehicle-mounted power supply and drive generally use axial flow fans to dissipate heat. The generated wind enters the casing from the air inlet, passes through the comp...

AI Technical Summary

Problems solved by technology

In the technical field of vehicle power supply and drive, the product size is small, the power density is relatively high, and natural heat dissipation cannot meet the requirements. Therefore, forced air cooling or liquid cooling is generally used to solve the problem of heat dissipation of internal power devices.

[0003] However, in the process of implementing the embodiments of the present invention, the inventors found that: the current vehicle-mounted power supply and drive generally use axial flow fans to dissipate heat. The generated wind enters the casing from the air inlet, passes through the components in the casing, and then is output from the air outlet. After the wind passes through the components, it will take away heat, thereby realizing heat dissipation for the components. In order to make full use of the space in the casing, the components are usually tightly packed. Distributed in the shell, so that the components will directly block the air duct from the air inlet to the air outlet, causing the wind to be forced to flow out from the surroundings, resulting in greater resistance and higher noise

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