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Molded article, metal-coated layered product, printed wiring board, and methods for producing these

A manufacturing method and metal coating technology, which is applied in the fields of printed circuit manufacturing, metal layered products, printed circuits, etc., can solve the problems of low UV wavelength domain absorption rate of tetrafluoroethylene polymers, and the decline of electrical properties such as electrical insulation , to achieve the effect of suppressing the decline of electrical characteristics and facilitating hole processing

Active Publication Date: 2020-06-16
ASAHI GLASS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, in recent years, along with the miniaturization of the wiring rules of printed wiring boards, there is a tendency to reduce the diameter of holes and use UV-YAG laser
[0005] Tetrafluoroethylene polymers have low absorption in the UV wavelength range
However, if a UV absorber is used, the electrical properties such as electrical insulation of tetrafluoroethylene-based polymers will decrease

Method used

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  • Molded article, metal-coated layered product, printed wiring board, and methods for producing these
  • Molded article, metal-coated layered product, printed wiring board, and methods for producing these
  • Molded article, metal-coated layered product, printed wiring board, and methods for producing these

Examples

Experimental program
Comparison scheme
Effect test

Embodiment

[0165] Hereinafter, the present invention will be specifically described by way of examples, but the present invention is not limited by the following description.

[0166] The raw materials used are as follows.

[0167] Polymer A1: A copolymer of TFE, NAH and PPVE produced according to paragraphs [0111] to [0113] of International Publication No. 2016 / 104297 (copolymerization composition: TFE unit / NAH unit / PPVE unit=97.9 / 0.1 / 2.0 (molar ratio), melting point: 305°C, melt flow rate: 11.0 g / 10 minutes).

[0168]Polymer A2: a copolymer of TFE and PPVE having a carbonate group at the end of the main chain (copolymerization composition: TFE unit / PPVE unit=98.0 / 2.0 (molar ratio), melting point: 310° C., melt flow rate: 11.0 g / 10 minutes).

[0169] Composition B1: Using a twin-screw extruder, 3 parts by mass of titanium oxide (manufactured by Sakai Chemical Co., Ltd. (Sakai Chemical Co., Ltd.), R-25, rutile type, Average particle diameter: 0.2 μm) and a composition obtained by kne...

example 1-1

[0179] Using a 65mmφ single-screw extruder having a 750mm wide coat hanger die shape, under a nitrogen atmosphere with a die temperature of 370°C and an oxygen concentration of 500ppm, the polymer A1 was extruded into a film to obtain a film F1 with a thickness of 12 μm. The absorption coefficient α of the film F1 is 1.6, the absorption coefficient β is 2.6, and the dielectric loss tangent is 0.0010.

example 1-2～ example 1-8

[0181] Film F2 was obtained in the same manner as in Example 1-1, except that the type of polymer and film forming conditions (thickness of the film, die temperature during extrusion molding, and atmosphere (oxygen concentration)) were changed as shown in Table 1. ~Film F8. Table 1 summarizes the types of polymers and film forming conditions in each example, and the physical properties of the obtained films. In addition, in the films F1 to F4, the content of components other than the polymer was 0.9% by mass or less.

[0182] [Table 1]

[0183]

[0184] *Furthermore, firing was carried out at 290° C. for 24 hours in an oven under a nitrogen atmosphere.

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Abstract

Provided are: a molded article, a metal-coated layered product, and a printed wiring board, all of which containing a tetrafluoroethylene polymer, in which an decrease in electrical characteristics isinhibited, and in which a hole can be easily bored with a UV-YAG laser; and methods for producing these. This molded article contains a tetrafluoroethylene polymer, wherein the contained amount of components other than the tetrafluoroethylene polymer is 0.9 mass% or less, and the molded article has an absorption coefficient of 1.2-4.5 in a wavelength range of 200-380 nm. A method according to thepresent invention is for producing the molded article. This metal-coated layered product has a layer of the molded article and a conductive metal layer. A method according to the present invention isfor producing the metal-coated layered product. This printed wiring board is provided with the metal-coated layered product, and has a through-hole in the thickness direction of a polymer layer.

Description

technical field [0001] The present invention relates to a molded body comprising a tetrafluoroethylene-based polymer, a metal-plated laminate, a printed wiring board, and a method for producing the same. Background technique [0002] For printed wiring boards used for transmission of high-frequency signals, transmission delay and transmission loss are required to be small. In order to improve transmission characteristics, it is necessary to use a material having a small relative permittivity and dielectric loss tangent as an insulating material for an electrical insulator layer of a printed wiring board. A tetrafluoroethylene-based polymer is known as a material having a small relative permittivity and a small dielectric loss tangent. [0003] Patent Documents 1 and 2 disclose a laminate for a printed wiring board in which a conductor and a film of a tetrafluoroethylene-based polymer are laminated. [0004] In printed wiring boards, through-holes are often formed in a lami...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08J5/18B32B15/08B32B27/30H05K1/03H05K3/00
CPCB32B15/08B32B27/30C08J5/18H05K1/0353H05K2201/015H05K3/022H05K3/0038C09D127/18C08J2327/18H01B3/445B32B2457/08B32B5/02B32B27/18B32B27/34B32B2307/714B32B2307/732B32B2262/0269B32B27/285B32B15/14B32B2255/06B32B2250/03B32B27/281B32B2250/40B32B2307/202B32B2255/205B32B3/266B32B27/36B32B15/20B32B27/12B32B2250/05B32B27/288B32B27/322B32B15/085B32B27/08B32B2307/306C08L27/18B32B15/082B32B37/10H05K1/034H05K3/12H05K2201/0355H05K2203/107Y10T428/24322Y10T428/24273
Inventor 笠井涉细田朋也
Owner ASAHI GLASS CO LTD
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