Composite multilayer graphite flake structure and manufacturing method, heat dissipation structure and electronic device

Abstract

The invention discloses a composite multilayer graphite sheet structure, a manufacturing method thereof, a heat dissipation structure and an electronic device. The heat dissipation structure comprisesa composite multilayer graphite sheet structure and an adhesive layer. The composite multilayer graphite sheet structure comprises a graphite material layer, a ceramic material layer and a radiationheat dissipation layer. The graphite material layer is provided with a first surface and a second surface, and the first surface and the second surface are opposite to each other. The ceramic materiallayer is disposed on the first surface. The radiation heat dissipation layer is arranged on the ceramic material layer, and the ceramic material layer is clamped between the graphite material layer and the radiation heat dissipation layer. The adhesive layer is arranged on the second surface, and the heat dissipation structure is adhered to a heat source through the adhesive layer. The compositemultilayer graphite sheet structure, the manufacturing method thereof, the heat dissipation structure and the electronic device have uniform heat conduction function and can achieve better heat dissipation effect.

Description

technical field [0001] The invention relates to a composite multilayer graphite flake structure with uniform heat conduction function, a manufacturing method thereof, a heat dissipation structure and an electronic device with the heat dissipation structure. Background technique [0002] With the development of science and technology, for the design and development of electronic devices, thinness and high performance are always given priority. In the case of high-speed computing, the electronic components of the electronic device will inevitably generate more heat than before, but the high temperature operating environment will not only affect the characteristics of the electronic components, but also may cause permanent damage to the electronic components. damage. [0003] In the existing heat dissipation field, the heat dissipation structure using graphite flakes has been used for a long time. However, because graphite flakes are thermally conductive materials in different...

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Problems solved by technology

In the case of high-speed computing, the electronic components of the electronic device will inevitably generate more heat than before, but the high temperature operating environment will not only affect the characteristics of the electronic components, but also may cause permanent damage to the electronic components. damage

[0003] In the existing heat dissipation field, the heat dissipation structure using graphite flakes has been used for a long time. However, because graphite flakes are thermally conductive materials in different directions, they only have the function of uniform temperature heat conduction in the plane direction (xy direction), and cannot really conduct heat in the z direction. Dissipate heat energy, so its heat dissipation effect still needs to be improved

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