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A kind of preparation method of columnar copper granular film

A copper particle and columnar technology is applied in the field of preparation of columnar copper particle films, which can solve the problems of poor structural uniformity, single product form, complicated process, etc., and achieves the effects of low cost, simple preparation process and good controllability.

Active Publication Date: 2020-05-19
HEBEI UNIV OF TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The main defects in the existing technology include: poor structural uniformity of the product, large pore size, complex process, high cost, single product form, etc.

Method used

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  • A kind of preparation method of columnar copper granular film
  • A kind of preparation method of columnar copper granular film
  • A kind of preparation method of columnar copper granular film

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0023] Add 0.6g acetic acid to 100g water, stir to dissolve, use it as electrolyte, copper sheet as anode, platinum sheet as cathode, the distance between anode and cathode is 2.0cm, anodic oxidation is carried out at 40°C and 40V DC, the reaction time for 20min. After the anodizing experiment, the copper sheet was removed and cleaned with deionized water.

[0024] Add 3.2g of copper sulfate and 0.06g of sodium 2-cyclohexylaminoethanesulfonate into 100g of water, stir and dissolve, use this solution as the electrodeposition solution, use the copper sheet that has been anodized before as the cathode, the platinum sheet as the anode, and the cathode The distance from the anode is 2.0cm, at room temperature, the current density is 85mA / cm 2 DC electrodeposition under the condition of 2min. After the experiment, the sample sheet was removed, washed with deionized water, and dried with warm air to obtain a columnar copper particle film.

[0025] figure 1 It is the surface morph...

Embodiment 2

[0029] Add 1.0g acetic acid to 100g water, stir to dissolve, use it as electrolyte, copper sheet as anode, platinum sheet as cathode, the distance between anode and cathode is 2.0cm, anodic oxidation is carried out at 40°C and 10V DC, the reaction time for 30min. After the anodizing experiment, the copper sheet was removed and cleaned with deionized water.

[0030] Add 6.5g of copper sulfate and 0.1g of sodium 2-cyclohexylaminoethanesulfonate to 100g of water, stir and dissolve, use this solution as the electrodeposition solution, use the copper sheet that has been anodized before as the cathode, the platinum sheet as the anode, and the cathode The distance from the anode is 2.0cm, at room temperature, the current density is 150mA / cm 2 DC electrodeposition under the condition of 1min. After the experiment, the sample sheet was removed, washed with deionized water, and dried with warm air to obtain a columnar copper particle film, the performance of which was similar to that ...

Embodiment 3

[0032] Add 0.1g acetic acid to 100g water, stir to dissolve, use it as electrolyte, copper sheet as anode, platinum sheet as cathode, the distance between anode and cathode is 2.0cm, anodic oxidation is carried out at 40°C and 50V DC, the reaction time for 5min. After the anodizing experiment, the copper sheet was removed and cleaned with deionized water.

[0033] Add 0.5g of copper sulfate and 0.01g of sodium 2-cyclohexylaminoethanesulfonate into 100g of water, stir and dissolve, use this solution as the electrodeposition solution, use the copper sheet that has been anodized before as the cathode, the platinum sheet as the anode, and the cathode The distance from the anode is 2.0cm, at room temperature, the current density is 25mA / cm 2 DC electrodeposition under the condition of 5min. After the experiment, the sample sheet was removed, washed with deionized water, and dried with warm air to obtain a columnar copper particle film, the performance of which was similar to that...

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Abstract

The invention relates to a preparation method of a columnar copper granular film. The method comprises the following steps of: (1) adding acetic acid into water, stirring for dissolution, taking the solution as an electrolytic solution, taking a copper sheet as an anode and a platinum sheet as a cathode for anodization to form the anodized copper sheet, and (2) adding copper sulfate and sodium 2-ethanesulphonate into the water, stirring for dissolution, taking the solution as an electro-deposition solution, and taking the anodized copper sheet as a cathode and the platinum sheet as an anode for direct current electro-deposition to form the columnar copper granular film. The method is simple in preparation technology, convenient to operate, good in controllability, and low in cost, and a product is novel in structure.

Description

Technical field: [0001] The invention belongs to the electrodeposition preparation of microstructure metallic copper materials, in particular to a method for preparing a columnar copper particle film. Background technique: [0002] Metallic copper with a specific microstructure is a commonly used electrode material and can be used in electrodes for supercapacitors, lithium-ion batteries, solar cells, electrolysis, and electro-Fenton reactions. [0003] There have been many reports on the preparation methods of metal copper materials with different microstructures. For example, "Nonferrous Metals" (2002, 54 (4), P17-20) reported the traditional preparation method of foamed copper. The process mainly includes polyurethane foam Pretreatment, electroless plating, electroplating, heat treatment, etc. "Material Science and Technology" (2014, 22 (1), P82-87) reported a method for preparing porous nano-metallic copper film by sol-gel method, which uses copper acetate as precursor a...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C25D11/34C25D3/38
CPCC25D3/38C25D11/34
Inventor 赵建玲宋敏王西新于晓飞杨晓婧
Owner HEBEI UNIV OF TECH
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