Rotary type high and low-thermal shock test apparatus

Abstract

The invention relates to a rotary type high and low-thermal shock test apparatus for testing the using property of an test object in high and low-thermal shock environment for instrument industry. Therotary type high and low-thermal shock test apparatus can process high or low-thermal shock test effectively and really. The technical scheme of the high and low-thermal shock includes that a high and low-thermal shock test is carried out effectively and really; a cool source and a hot source are installed on the upper portion of the inner side of the cylindrical wall of an insulating chamber in180 degrees distribution, detectors are circumferentially evenly arranged on the upper portion of the inner side of the cylindrical wall of a heat insulating chamber, an upper magnet base and a thrustbearing a are totally placed in the stepped bore of the inner chamber of an upper fixed base, heat insulated supports are circumferentially evenly placed on a stage, a lower magnet base, a thrust bearing b and a thrust bearing c are totally placed in the stepped bore of the inner chamber of a lower fixed base, the left end of a transmission shaft is fixed to a bevel gear b, and the right end of the transmission shaft is connected with a variable-frequency deceleration motor via a coupling. The rotary type high and low-thermal shock test apparatus controls the rotation speed of the stage, thecontrol of the high and low-thermal circulation frequency of the test object can be realized, and the stable and uniform thigh and low-thermal shock test can be realized.

Description

technical field [0001] The invention relates to a turntable type high and low temperature impact test device used for testing the service performance of a test piece in a cold and heat impact environment in the instrumentation industry. Background technique [0002] High and low temperature impact test is an essential test experiment item in the metal, plastic, rubber, electronics and other material industries. It is used to test the tolerance of material structures or composite materials in a continuous environment of extremely high temperature and low temperature, and can be detected in a short time The chemical change or physical damage caused by thermal expansion and contraction of the sample. [0003] Especially for electronic products, high and low temperature impact tests must be carried out. It is necessary to test the degree of aging of electronic products after experiencing high and low temperature environmental changes. In the electronic technology industry, such...

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Problems solved by technology

[0004] If the performance and parameters of electronic products are not good enough after the production is completed, then there will be major problems in the basic test, and such products are directly classified as defective products and cannot be shipped.

For those potential defects and problems, general testing methods cannot detect them. For example, problems such as soldering voids and poor matching of products may need to be discovered during use.

At this time, it is very necessary to pass the high and low temperature impact test, otherwise it is necessary to know that the potential defects will not be activated until after a long period of normal use, and once a problem occurs at this time, it will obviously bring great losses

[0005] At present, the equipment and methods for high and low temperature impact tests generally use high and low temperature impact test chambers to circulate heating and cooling, or alternately heat in the heating box and cool in the cooling box. Both of the above two methods have heating and cooling that are not in a balanced and stable environment. The temperature of the test piece has the problem of sudden rise and fall, which makes it difficult to simulate the real working conditions of many products in the process of uniform heating and cooling

In addition, the sudden rise and fall of the heating method may lead to a huge difference between the surface temperature and the internal temperature of the specimen, which may cause the specimen to be destroyed in advance due to factors such as thermal expansion and contraction.

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