A kind of encapsulation method of cob display module and display module thereof

Abstract

The invention relates to an encapsulating method of a COB (chip-on-board) display module and the display module. The encapsulating method of the COB display module comprises the following steps: S1: manufacturing a substrate, wherein the substrate comprises an upper circuit board and a lower circuit board which are arranged in a superposed mode, N pieces of LED light emitting unit mounting areas are arranged on the upper circuit board, wherein N is an integer which is greater than or equal to 1, and at least one through hole, which runs through the lower circuit board, is formed in the lower circuit board; S2: fixedly mounting LED light emitting units in the LED light emitting unit mounting areas of the upper circuit board; S3: encapsulating a protective layer on the surface of the upper circuit board and covering the LED light emitting units with the protective layer; S4: conducting cutting along the boundaries of the LED light emitting unit mounting areas in a mode of penetrating the protective layer and the upper circuit board, so as to form runners; and S5: injecting a boundary material into the runners through the through hole in the lower circuit board, so that a light shield layer is formed. According to the encapsulating method provided by the invention, glue injection can be conducted easily, and by virtue of the formed light shield layer, a mutual light mixing phenomenon between the adjacent LED light emitting units can be completely blocked, so that a contrast ratio is improved.

Description

technical field [0001] The invention belongs to the field of manufacturing photoelectric devices, and in particular relates to a packaging method of a COB display module and a display module thereof. Background technique [0002] In recent years, LED display technology has developed rapidly and is favored by people. It is widely used in large squares, financial markets, airports, banks, hospitals and shopping malls. With the development of LED display technology, products are increasingly developing in the direction of high-density, small-pitch and full-color high-resolution. At present, the minimum size range of RGB display discrete devices is 0.5-1.0mm. The miniaturization of a single device faces many problems such as chip assembly, packaging and testing, and the miniaturization manufacturing cost of RGB display discrete devices is relatively high. In addition, when discrete devices are used for display integration, the integration density of the display is reduced due t...

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Problems solved by technology

[0005] However, since the slit 16 is formed by molding, the depth of the slit 16 is less than the thickness of the protective layer 15, and the slit 16 does not touch the upper surface of the substrate 11, so that part of the light emitted by the adjacent light-emitting unit 13 will pass through the slit. The protective layer between the lower part of 16 and the upper surface of the substrate 11 produces mixed light, which cannot be completely avoided; and the bottom of the slit 16 is not connected to the air, and it is easy to cause filling when epoxy resin AB glue is filled in the slit Inhomogeneity or defects such as bubbles, the formed light-shielding layer cannot effectively absorb or reflect the light emitted by the light-emitting unit 13

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