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Insulating plate manufacture method and insulating plate manufactured by using same

A manufacturing method and insulating board technology, applied in the PCB field, can solve the problems of risk, high cost, uneven polishing, etc., and achieve the effects of avoiding the decrease of adhesion, high production efficiency, and good flatness

Inactive Publication Date: 2013-12-25
GUANGDONG SHENGYI SCI TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The former is time-consuming and laborious, and sometimes the polishing is uneven, or the release agent cannot be completely removed, which still has risks and increases costs; although the latter can avoid the residue of the release agent, it needs to consume two copper foils for each insulating board and increase etching. Baking process, the cost is too high

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0016] Embodiment 1 A method for making an insulating board, comprising the steps of:

[0017] Take glass fiber cloth and impregnate 100 parts of epoxy resin composition on it. The resin composition contains an imidazole accelerator with a mass content of 1%, and it is baked at 190 ° C for 5 minutes by a glue machine to complete online curing, that is, Get the insulating board. The model of the glass fiber cloth is 106. The imidazole accelerator is 2-ethyl-methylimidazole.

Embodiment 2

[0018] Embodiment 2 A method for making an insulating board, comprising the steps of:

[0019] Take glass fiber cloth and impregnate 100 parts of epoxy resin composition on it. The resin composition contains a high-efficiency catalyst with a mass content of 0.4%, and it is baked at 190°C for 5 minutes by a glue machine to complete online curing. the insulating board. The model of the glass fiber cloth is 1086. The high-efficiency catalyst is a replacement urine accelerator.

Embodiment 3

[0020] Embodiment 3 A method for making an insulating board, comprising the steps of:

[0021] Take glass fiber cloth and impregnate 100 parts of epoxy resin composition on it. The resin composition contains a high-efficiency catalyst with a mass content of 0.3%, and it is baked at 230°C for 3 minutes by a gluing machine to complete online curing to obtain the insulating board. The model of the glass fiber cloth is 3313. The high-efficiency catalyst is metal acetylacetonate.

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PUM

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Abstract

The invention provides an insulating plate manufacture method. The method comprises the following steps: soaking an epoxy resin composition on glass-fiber cloth; baking for 3-10 minutes at 150-230 DEG C by using a glue machine to complete online curing to obtain the insulating plate. According to the method, the soaked resin composition is cured in a short time at a high temperature by virtue of a method for increasing the dosage of an accelerant or selecting a high-performance catalyst, and the insulating plate is produced by an online curing mode, so that the problem of release agent residues in a traditional method can be solved, the production efficiency can be improved, and the insulating plate is good in thickness uniformity and good in flatness.

Description

technical field [0001] The invention relates to the technical field of PCB, in particular to a method for manufacturing an insulating board and the insulating board. Background technique [0002] A kind of insulating board is often used in PCB. The insulating board is often used as a reinforcing material in FPCB or rigid-flexible PCB, commonly known as reinforcing board; it can also be used in the core board of multi-layer PCB to achieve sufficient thickness and avoid using Too much prepreg reduces flow. At present, the production method of this kind of insulating board is mainly to impregnate the epoxy resin composition on the glass fiber cloth, bake it into a prepreg adhesive sheet by a baking machine, and then place a release type on both sides of the prepreg adhesive sheet. film, which is laminated under high temperature and pressure to obtain a fully cured insulation board. However, during lamination, the release agent will be precipitated and remain on the surface of...

Claims

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Application Information

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IPC IPC(8): C08J5/24C08L63/00
Inventor 汪青刘东亮
Owner GUANGDONG SHENGYI SCI TECH
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